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Rogers 2.0mm 3 OZ Copper PCB , Immersion Gold Copper Printed Circuit Board

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Shenzhen Lefang Electronics Co., Ltd

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Rogers 2.0mm 3 OZ Copper PCB , Immersion Gold Copper Printed Circuit Board

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Brand Name :	LEFANG
Model Number :	OT6002L355
Certification :	ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Price :	Negotiable
Payment Terms :	T/T, Western Union, Paypal, MoneyGram
Supply Ability :	290, 000 sqm Per Month
Delivery Time :	2-10 work days

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Rogers 2.0mm 3 OZ Copper PCB , Immersion Gold Copper Printed Circuit Board

Rogers 2.0mm 3 OZ Immersion Gold Heavy Copper PCB Printed Circuit Board

For the thick copper PCB Board, it is usually allow higher current to go through. The layer count of this heavy copper PCB is 2 and the copper thickness is 3 OZ / 105 µm. Also, the surface treatment of this thick copper PCB Board is Immersion Gold. Its minimum aperture is 0.4 mm, and the line width and space are 0.8 mil.

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc

Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)

Material Specification:High Tg / copper based / aluminum based or others (optional)

Board thickness: 0.1 - 6.0 mm

Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )

Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin

Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc

Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE
Board material	Fr - 4
Material brand	KB
Material Specification	Tg 170
Board thickness	1.6 mm
Copper thickness	1 Oz
Surface Treatment	ENIG
Solder mask / sSilk print	Green / White
Board size	100 mm * 100 mm
Quantity	10k

Technical Data

Item	Details
Max layer count	20 L
Max board thickness	6.0 mm
Max aspect ratio	10 : 1
Max copper thickness	6 OZ
Max dimension	600 * 700mm
Min thickness of 4 layers PCB	0.4 mm
Min hole / pad	0.15 / 0.35mm
Hole location accuracy	+ / - 0.05mm
PTH hole tolerance	+ / - 0.05mm
Min line width and line space	0.065 / 0.065mm
Surface treatment	HASL / HASL lead free, OSP Immersion gold/silver/tin, gold plating (hard gold and soft gold), silver plating, tin plating, platinum plating, carbon ink, ENEPIG (electroless nickel - electroless palladium - immersion gold)

Lead Time

Layer count	Sample lead time/workday	Batch lead time/workday
1-2L	2	6
4L	5	8
6L	5	9
8L	6	10
10L	8	10
12L	8	12
14L	10	15
16L	10	18
18-40L (Up to difficulty)	at least 18	at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

How many advanced automated equipments do we have?

-- We have spent massively on purchasing below advanced automated production equipments.

Equipment Name	Plant in Shenzhen	Plant in Dongguan
CCD exposure machine	8	12
AOI test machine	6	8
Mechanical drilling rig	26	53
Automatic edge finishing machine	2	2
Pressing machine	2	2
VCP	0	2
Electroplating line	1	2
CNC routing machine	12	12
Automatic tester	10	16

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base platform of double sided plated.
This methodology would again allow circuit board designers a dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

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