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1.0 MM Aluminum Led Metal Core Pcb , 1 Layer Led Pcb Circuit Board Eco Friendly

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Shenzhen Lefang Electronics Co., Ltd

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1.0 MM Aluminum Led Metal Core Pcb , 1 Layer Led Pcb Circuit Board Eco Friendly

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Brand Name :	LEFANG
Model Number :	RM0001L162
Certification :	ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Price :	Negotiable
Payment Terms :	T/T, Western Union, Paypal
Supply Ability :	290, 000sqm Per Month
Delivery Time :	2-10 work days

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1.0 MM Aluminum Led Metal Core Pcb , 1 Layer Led Pcb Circuit Board Eco Friendly

1.0 MM Aluminum Single Sided PCB Circuit Board for LED Lighting with ENIG

The single sided PCB is applied for LED Lighting, with only 1.0 mm board thickness. The specification of the single sided PCB Board is 29 * 29 mm, with white solder mask and immersion gold surface treatment. And the minimum aperture is 0.2 mm.

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc

Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)

Material Specification:High Tg / copper based / aluminum based or others (optional)

Board thickness: 0.1 - 6.0 mm

Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )

Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin

Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc

Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE
Board material	Fr - 4
Material brand	KB
Material Specification	Tg 170
Board thickness	1.6 mm
Copper thickness	1 Oz
Surface Treatment	ENIG
Solder mask / sSilk print	Green / White
Board size	100 mm * 100 mm
Quantity	10k

Technical Data

No.	Item	Data
1	Layer count	1-20 layers
2	Raw material type	Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper based, aluminum based
3	Raw material brand	Rogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc
4	Board thickness	0.1-6.0mm
5	Max board size	600 mm * 700 mm
6	Solder mask	Green, red, blue, black, white, yellow
7	Surface treatment	HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating (hard gold and soft gold), silver plating, tin plating, platinum plating, carbon ink, and ENEPIG(electroless nickel - electroless palladium - immersion gold)
8	Copper thickness	0.05 Oz - 8 Oz (17 um-288 um )
9	Min Line width /space	0.065 mm / 0.065 mm
10	Finished hole size	0.10 - 5.95 mm
11	Blind/buried via	0.10 mm
12	Aspect ratio	10:1
13	PTH tolerance	+ / - 0.05 mm
14	Hole location tolerance	+ / - 0.05 mm
15	Impedance control tolerance	+ / - 8% mm
16	Outline tolerance	+ / - 0.10 mm

Lead Time

Layer count	Sample lead time/workday	Batch lead time/workday
1-2L	2	6
4L	5	8
6L	5	9
8L	6	10
10L	8	10
12L	8	12
14L	10	15
16L	10	18
18-40L (Up to difficulty)	at least 18	at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

What kinds of quality Raw Materials will be used?

Board Brand	ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
Potion	Rohm & Haas, Atotech, Umicore
Printing Ink	Taiyo, Rongda
Dry Film	Asahi, Dupont, Etertec

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

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